High-efficiency liquid cooling plate solution: customized multi-specification copper tube water cooling plate technology
Publish Time: 2024-08-09
As the requirements for heat dissipation performance of electronic equipment and industrial systems continue to increase, efficient thermal management solutions have become particularly important. This article will take a deep look at the copper tube water cooling plate technology designed to handle high-power cooling applications, and how we provide customized multi-specification liquid cooling plate cooling solutions.1. Overview of liquid cooling plate technologyLiquid cooling plate, also known as liquid cooling plate, is a device that uses liquid circulation to dissipate heat. It usually consists of a metal substrate, microchannels, a water pump, a radiator, and a control system. The metal substrate (such as copper or aluminum) is in direct contact with the heat source, and the heat is quickly transferred to the microchannel through a high thermal conductivity material. The circulating coolant absorbs the heat and is transported to the radiator, and the heat is discharged to the external environment through a fan. This technology provides a strong guarantee for the stable operation of electronic equipment with its excellent heat dissipation performance.2. Technical features of copper tube water cooling plate1. High thermal conductivityThe copper tube water cooling plate uses copper or aluminum substrates. These materials have high thermal conductivity and can quickly transfer heat from the heat source to the coolant, thereby improving heat dissipation efficiency.2. Customized designAccording to the specific needs of customers, we provide copper tube water cooling plate solutions in various specifications and designs. Whether it is a single-phase or dual-phase (with liquid-vapor phase change) system, it can be customized according to the cooling requirements.3. High power handling capabilityOur copper tube water cooling plate is designed for high-power cooling applications, with a cooling power of more than 2000W and a heat flux of more than 1000W/cm², which can effectively meet the needs of high-heat devices such as CPU, GPU, power module, battery pack, charging station, etc.4. Multiple material optionsDepending on the application scenario and cost considerations, the liquid cooling plate can be made of a variety of materials such as copper base, aluminum base or titanium base to meet the needs of different customers for heat dissipation performance and durability.3. Customized multi-specification liquid cooling plate cooling solution1. Accurate designDuring the design stage, we comprehensively consider factors such as the structure of the power module, power consumption, coolant ratio and heat dissipation efficiency, and design the optimal liquid cooling plate structure through simulation analysis and experimental verification. For example, for IGBT modules, we determine the surface temperature of the heat sink based on the heat flux and heat generation to ensure that the chip temperature of the IGBT is controlled within a safe range.2. Precision machiningUse precision machining technologies such as CNC machining and electrochemical machining to manufacture precise flow channels and structures. During the welding process, we use advanced technologies such as brazing and stir friction welding to ensure the sealing and reliability of the coolant circulation system.3. Flow channel optimizationIn order to further improve the heat dissipation effect, we optimize the flow channel structure. For example, compared with the linear uniformly distributed flow channel, the S-shaped water channel can improve the problem of uneven fluid distribution and improve the heat dissipation efficiency. At the same time, by adjusting parameters such as the thickness of the cold plate, the width of the flow channel and the number of parallel flow channels, the convection heat exchange area can be further optimized and the heat dissipation performance can be improved.4. Intelligent controlIntegrate sensors and control units to realize intelligent monitoring and automatic adjustment of the liquid cooling system. This can not only improve the stability and reliability of the system, but also reduce operation and maintenance costs and improve user experience.4. Application fields1. Data centerUsed for cooling servers and network equipment to improve the energy efficiency and operation stability of data centers.2. Electronic equipmentSuch as high-performance computers, game consoles, communication base stations, etc., liquid cooling plates can effectively reduce the operating temperature of equipment and improve equipment performance and stability.3. New energy vehiclesUsed for cooling battery packs and motors of electric vehicles to extend battery life and improve vehicle performance.4. Industrial automationIn automation equipment and precision instruments, liquid cooling plates protect key components from overheating and ensure stable operation of production lines.Copper tube water cooling plate technology has great potential in high-power cooling applications with its excellent heat dissipation performance and customized multi-specification solutions. We are committed to providing customers with efficient, reliable and intelligent liquid cooling plate cooling solutions to promote electronic equipment and industrial systems to develop in the direction of higher performance and higher reliability. With the continuous advancement of technology and the growth of market demand, liquid cooling plate technology will play an important role in more fields and become an important trend in the field of thermal management in the future.
